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Rogers With Fr4 8 Layer Filled Vias Multilayer Metal Core PCB Prototype

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Rogers With Fr4 8 Layer Filled Vias Multilayer Metal Core PCB Prototype

Rogers With Fr4 8 Layer Filled Vias Multilayer Metal Core PCB Prototype

Rogers With Fr4 8 Layer Filled Vias Multilayer Metal Core PCB Prototype General information: Material:Rogers3003 5mi Mix stack up FR4 TG170 Layer:8 Board size: 3.2*5cm Total thickness: 2.2mm Copper ...

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Rogers With Fr4 8 Layer

      

Multilayer Metal Core PCB

      

Metal Core PCB Prototype

      
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